BGA | HSBGA
OverviewHeatslugBGA(HSBGA)isanupgradedtypeofPBGA.Withinthemoldingarea,apieceofcopperheatslugisimpla...
BGA | Side by ...
OverviewSidebysideMCMPBGAandsidebysideMCMHSBGAarethetypesofMCMsofferedbyASE.MCMHSBGAincludesmultihe...
BGA | Stacked ...
OverviewASEoffersstackedBallGridAllaypackagesthatcombineBGApackagesolutionsontoMCMtype.StackedBGAsa...
BGA | PBGA
OverviewPlasticballgridarray(PBGA)areBGApackagesadoptingplastic(epoxymoldingcompound)astheencapsula...
QUAD | Stacked...
OverviewStackedleadframewithsamefeaturesasQFP/LQFP/TQFPisavailablenow,withmulti-chipstructures.Tota...
QUAD | LQFP/TQ...
OverviewLowprofileandthinquadflatpackages(QFP)areclassifiedbytheoverallthickness(t)accordingtoJEDEC...
QUAD | QFP
OverviewQuadflatpackage(QFP)ispopularamongthequadpackages.Thereasonisthefineetchingorstampingleadfr...
QUAD | PLCC
OverviewPLCCPlasticLeadedChipCarrier(PLCC)iswidelyusedinmicro-controllersandconsumerelectronics.Eac...
Dual-in-Line |...
OverviewSmallOutlineJ-leaded(SOJ)packageissimilartoPDIP,buttheleads'endareformedina&quo...
Dual-in-Line |...
OverviewTSOP(I)/TSOP(II)TSOP(I)andTSOP(II)arethinprofilesmalloutlinepackageswithanoverallthicknesso...
Dual-in-Line |...
OverviewThefeaturesofsmalloutlinepackage(SOP)aresimilartoSOJ,exceptthattheleads'endisformed...
Dual-in-Line
OverviewDual-in-Linepackageshavebeenanindustrystandardformanyyears.Theapplicationsarecommoninconsum...