Dual-in-Line _ SOP/SSOP_Assembly Offerings相关信息_苏州日月新半导体有限公司

苏州日月新半导体有限公司

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Dual-in-Line | SOP/SSOP

价格：面议

有效期：长期有效

所在地：江苏省苏州市

配送信息：

无

供应数量：不限

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详细说明

Overview

The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The shrunk body means flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.

Application

ASE's SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances.

Features

SOP Body sizes 154 up to 450 mils

SSOP Body sizes 300 mils

SOP lead counts available from 8 to 32

SSOP lead counts available 48 & 56

JEDEC standard outlines

Existing BOM and process flow

Pb-free process ready and available

Reliability

Package Level

Test Item	Reference Standard	Condition/Duration
MSL	JEDEC 22-A103	Level 3, 30oC/60% RH, 192 hrs
TCT	JEDEC 22-A104-B	-65oC to 150oC, 100/300/500/1000 cycles
HAST	JEDEC 22-A118	130oC/85% RH, 33.5 PSI 48/96 hrs
HTST	JEDEC 22-A103-B	150oC, 500/1000 hrs
THT	JEDEC 22-A101-B	85’C/85%RH 500/1000 hrs
PCT	JEDEC 22-A102	121oC/100%RH/15 psi ,96/168 hours
Thermal shock test	JEDEC JESD22-A106	-65oC~150oC, 100 / 300 / 500 cycles

Board Level (Contact ASE for further details.)

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苏州日月新半导体有限公司
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