Dual-in-Line _ TSOP(I)/TSOP(II)_Assembly Offerings相关信息_苏州日月新半导体有限公司

苏州日月新半导体有限公司

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Dual-in-Line | TSOP(I)/TSOP(II)

价格：面议

有效期：长期有效

所在地：江苏省苏州市

配送信息：

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供应数量：不限

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详细说明

Overview

TSOP(I)/ TSOP(II)
TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(II) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side.

Application

Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones, and memory modules.
Telecommunication Products
Cellular Phone Wireless LAN
Portable Products
Personal Digital Assistants Digital Camera Audio/Video
Low Pin Count Packages
Information Appliances

Features

Low profiles and lightweight

Steady yield

Low cost

Pb-free Process ready and available

TSOP(I) body size from 11.8x8 up to 18.4x12mils

TSOP(II) body size from 17.1x7.6 up to 22.2x10.2mils

TSOP(I) lead counts available 28/32/40/48

TSOP(II) lead counts available 20/24/40/44/50/54

JEDEC standard outlines

Existing BOM and process flow

Reliability

Package Level

Test Item	Reference Standard	Condition/Duration
MSL	JEDEC 22-A103	Level 3, 30°C/60% RH, 192 hrs
TCT	JEDEC 22-A104-B	-65°C to 150°C, 100/300/500/1000 cycles
HAST	JEDEC 22-A118	130°C/85% RH, 33.5 PSI 48/96 hrs
HTST	JEDEC 22-A103-B	150°C, 500/1000 hrs
THT	JEDEC 22-A101-B	85°C/85%RH 500/1000 hrs
PCT	JEDEC 22-A102	121°C/100%RH/15 psi ,96/168 hours

Board Level (Contact ASE for further details.)

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免责声明：本商铺所展示的信息由企业自行提供，内容的真实性、准确性和合法性由发布企业负责，一比多公司对此不承担任何保证责任。

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