Overview

Stacked leadframe with same features as QFP/LQFP/TQFP is available now, with multi-chip structures.

Total thickness is according to JEDEC definition. They are ideal for applications in lightweight and portable electronic products.

Depending on lead counts, die counts and thickness requirements, this works with almost all applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.

For more details, please refer to SiP_Stacked Leadframe